Hardback (31 Dec 1998)
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The aim of this volume is to provide a forum for technical communication focused on the needs and interests of power electronics components and system design engineers. Topics covered include: 3-D power packaging; CAD tools; EMI effects in packaging; fabrication techniques; and power supply.
| ISBN: | 9780780350335 |
| Publisher: | IEEE |
| Imprint: | IEEE |
| Pub date: | 31 Dec 1998 |
| DEWEY: | 621.381045 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 79 |
| Weight: | -1g |
| Height: | 266mm |
| Width: | 209mm |
| Spine width: | 6mm |
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