Thermophysical Properties of Materials and Devices

Thermophysical Properties of Materials and Devices IVth National Conference on Thermophysical Properties --NCTP '07 ; Kollam, Kerala, India, 20-23 September 2007 - AIP Conference Proceedings

2008

Hardback (01 Jun 2008)

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Publisher's Synopsis

NCTP'07 was the fourth in a series of biannual conferences on thermophysical properties being organized by the prestigious Thermophysical Society of India. The first Asian Thermophysical conference was held in Guwahati University in 1994, the second in the Rajasthan University; Jaipur and the third in the University of Goa. All papers have been peer-reviewed. These Conferences are designed to be unique forums for the exchange of ideas and the newest technical information on thermophysical properties, as well as materials characterization for both the novice and the expert, and for the experts to share experiences with their peers.

Book information

ISBN: 9780735405233
Publisher: American Institute of Physics
Imprint: American Institute of Physics
Pub date:
Edition: 2008
DEWEY: 530
DEWEY edition: 22
Language: English
Number of pages: 361
Weight: 676g
Height: 234mm
Width: 162mm
Spine width: 25mm