Advances in Electronic Packaging, 1993 Proceedings of the 1993 ASME International Electronics Packaging Conference : Presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 - EEP
Book (01 Jan 1993)
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Book information
| ISBN: | 9780791806869 |
| Publisher: | American Society of Mechanical Engineers |
| Imprint: | American Society of Mechanical Engineers |
| Pub date: | 01 Jan 1993 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 20 |
| Language: | English |
| Number of pages: | 1200 |
| Height: | 230mm |
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