Analysis of Grounding and Bonding Systems

Analysis of Grounding and Bonding Systems

Hardback (02 Jun 2020)

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Book information

ISBN: 9780367341251
Publisher: CRC Press
Imprint: CRC Press
Pub date:
DEWEY: 621.317
DEWEY edition: 23
Language: English
Number of pages: 154
Weight: 371g
Height: 234mm
Width: 156mm
Spine width: 11mm