Analysis of Grounding and Bonding Systems

Analysis of Grounding and Bonding Systems

Paperback (31 May 2023)

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Publisher's Synopsis

Learn the theory behind grounding systems and bonding equipotential connections from a worldwide expert. Through mathematical analysis, comprehensive explanations, and detailed figures, Analysis of Grounding and Bonding Systems explains the theory and the reasons behind basic ground-electrodes (i.e., the sphere, the ground rod, and the horizontal ground wire), and more complex grounding systems (i.e., ground-grids), buried in uniform and non-uniform soils.

Through calculations and explanatory diagrams, this comprehensive guide provides code-complying solutions for the safety against electric shock provided by equipotential bonding connections between exposed-conductive-parts, such as equipment enclosures, and metalwork. Details on the calculation of step and touch voltages in different types of system grounding (i.e., TT, TN, and IT) are provided, also with the aid of solved problems.

Readers will learn how to minimize hazardous interactions between grounding systems, cathodically protected pipelines, and heat networks. The analysis of the effectiveness of bonding systems against electric shock in the case of contact with electric vehicles during charge in the event of ground-faults, which is an upcoming issue challenging our safety, is included.

Book information

ISBN: 9780367498252
Publisher: CRC Press
Imprint: CRC Press
Pub date:
DEWEY: 621.317
DEWEY edition: 23
Language: English
Number of pages: 154
Weight: 453g
Height: 234mm
Width: 156mm
Spine width: 9mm