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Third International Conference on Thin Film Physics and Applications

Third International Conference on Thin Film Physics and Applications 15-17 April 1997, Shanghai, China - SPIE Proceedings Series

Paperback (20 Feb 1998)

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Book information

ISBN: 9780819426734
Publisher: SPIE
Imprint: SPIE
Pub date:
DEWEY: 530.4275
DEWEY edition: 21
Language: English
Number of pages: 476
Weight: -1g

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