Hardback (17 May 1993)
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Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
| ISBN: | 9780471584711 |
| Publisher: | Wiley |
| Imprint: | Wiley-Interscience |
| Pub date: | 17 May 1993 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 20 |
| Language: | English |
| Number of pages: | 369 |
| Weight: | 658g |
| Height: | 231mm |
| Width: | 157mm |
| Spine width: | 28mm |
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