Publisher's Synopsis
The book is a detailed review of how microelectronic substrates are diced and what type of dicing machines and dicing blades are used. A brief review of each application end product is also covered. The book covers all the important dicing saws technical specs to be monitored in order to meet the substrates / devices quality specs.
The other side of the review covers the dicing blades technologies of the different dicing blades matrices and geometries. The dicing blades review talks about the bond technology and the manufacturing processes of the different blade types. The major applications in the microelectronic industries are covered in detail. This section includes the dicing saw types, dicing parameters, mounting technics, coolant designs and others. The dicing blade side is also covered per application.
Some unique and difficult applications require different singulation technologies which are also covered in this unique book.
The dicing saws, the blade technology and the application review are covered with detailed sketches and photos.
