Hardback (01 Jan 1998)
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From a September 1991 international workshop in Ithaca, New York, 18 papers address the growing concern over the impact of stress-induced voiding and related phenomena on reliability in very large scale integrated circuits, as the circuit features become ever smaller and challenge the capabilities of available materials. The topics include reviews
| ISBN: | 9781563960826 |
| Publisher: | American Institute of Physics |
| Imprint: | American Inst. of Physics |
| Pub date: | 01 Jan 1998 |
| DEWEY: | 621.38152 |
| DEWEY edition: | 20 |
| Language: | English |
| Number of pages: | 280 |
| Weight: | 610g |
| Height: | 230mm |
| Width: | 150mm |
| Spine width: | 20mm |
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