Paperback (31 Mar 2002)
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This volume originates from the 18th Symposium on Semiconductor Thermal Measurement and Management and examines components. It covers topics including: advances in compact models; package and material characterization; system level analysis; and liquid cooling application.
| ISBN: | 9780780373273 |
| Publisher: | I.E.E.E.Press |
| Imprint: | I.E.E.E.Press |
| Pub date: | 31 Mar 2002 |
| DEWEY: | 621.38152 |
| Language: | English |
| Number of pages: | 210 |
| Weight: | -1g |
| Height: | 279mm |
| Width: | 216mm |
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