Paperback (19 Dec 2020)
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Disclosed is a semiconductor package including: a base substrate provided with at least one cavity and made of a metallic material; at least one semiconductor chip mounted in the cavity; and a heat dissipating member arranged in a gap between an inner surface of the cavity and the semiconductor chip.
| ISBN: | 9798582905882 |
| Publisher: | Independently Published |
| Imprint: | Independently Published |
| Pub date: | 19 Dec 2020 |
| Language: | English |
| Number of pages: | 26 |
| Weight: | 86g |
| Height: | 280mm |
| Width: | 216mm |
| Spine width: | 1mm |
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Paperback
Published 07 Dec 2023
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