Reliability and Yield Problems of Wire Bonding in Microelectronics The Application of Materials and Interface Science
Book (01 Jan 1989)
Not available for sale
Includes delivery to the United States
Out of stock
Check stock
Book information
| ISBN: | 9780930815257 |
| Publisher: | International Society for Hybrid Microelectronics |
| Imprint: | International Society for Hybrid Microelectronics |
| Pub date: | 01 Jan 1989 |
| DEWEY: | 621.3815 |
| DEWEY edition: | 20 |
| Language: | English |
| Number of pages: | 202 |
| Weight: | 476g |
| Height: | 234mm |
| Width: | 158mm |
| Spine width: | 19mm |
Blackwell's Bestsellers
$2.11off
Things No One Taught Us About L...
Paperback
Published 25 Apr 2024
Save $2.11
RRP $14.05- $11.94
$2.01off
Daisy Haites. The Great Undoing
Paperback
Published 15 Dec 2022
Save $2.01
RRP $19.16- $17.15
Children of Anguish and Anarchy
Limited Edition Signed by the Author
Hardback
Published 25 Jun 2024
- $21.72
$2.67off
Madrigal's Magic Key to Spanish
Paperback
Published 01 Sep 1989
Save $2.67
RRP $24.27- $21.60
