Publisher's Synopsis
Topics covered in this volume include: silicide/salicide; dielectrics; planarization; metallization; process integration; process control/modelling; reliability; and interconnect systems.
Proceedings of the IEEE 2001 International Interconnect Technology Conference June 4-6, 2001, Hyatt Regency Hotel, Burlingame [I.e. San Francisco, CA]
Hardback (30 Jun 2001)
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Book information
| ISBN: | 9780780366787 |
| Publisher: | IEEE |
| Imprint: | IEEE |
| Pub date: | 30 Jun 2001 |
| DEWEY: | 621.38152 |
| DEWEY edition: | 22 |
| Language: | English |
| Number of pages: | 300 |
| Weight: | -1g |
| Height: | 273mm |
| Width: | 209mm |
| Spine width: | 12mm |
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