Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems -2018-

Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems -2018- Presented at ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, August 27-30, 2018, San Francisco, California, USA

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Publisher's Synopsis

Printed collection of 62 full-length, peer-reviewed technical papers. Topics include:

  • Heterogeneous Integration: Micro-Systems With Diverse Functionality
  • Servers of the Future, IoT, and Edge to Cloud
  • Structural and Physical Health Monitoring
  • Power Electronics, Energy Conversion, and Storage
  • Autonomous, Hybrid, and Electric Vehicles

Book information

ISBN: 9780791851920
Publisher: American Society of Mechanical Engineers
Imprint: ASME
Pub date:
DEWEY: 621.381046
DEWEY edition: 23
Language: English
Number of pages: 558
Weight: -1g