Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems -2017- Presented at ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, August 29-September 1, 2017, San Francisco, California, USA

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, American Society of Mechanical Engineers (publisher)

Paperback (28 Feb 2018)

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Publisher's Synopsis

Printed collection of 88 full-length, peer-reviewed technical papers. Topics include: Heterogeneous Integration; Micro-Systems with Diverse Functionality; Servers of the Future; Structural and Physical Health Monitoring; Energy Conversion & Storage; Transportation: Autonomous & Electric Vehicles

Book information

ISBN:	9780791858097
Publisher:	American Society of Mechanical Engineers
Imprint:	ASME
Pub date:	28 Feb 2018
DEWEY:	621.381046
DEWEY edition:	23
Language:	English
Number of pages:	756
Weight:	-1g
Height:	229mm
Width:	152mm