Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2015 Presented at the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : July 6-9, 2015, San Francisco, California, USA

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (creator), American Society of Mechanical Engineers (publisher), International Conference on Nanochannels, Microchannels and Minichannels (contributor)

Paperback (30 Jul 2015)

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Publisher's Synopsis

Print proceedings of the ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2015): Volume 1: Thermal Management.

Printed collection on 89 full-length, peer-reviewed technical papers. Topics include:

Thermal Management

Book information

ISBN:	9780791856888
Publisher:	American Society of Mechanical Engineers
Imprint:	ASME
Pub date:	30 Jul 2015
Language:	English
Number of pages:	784
Weight:	-1g
Height:	229mm
Width:	152mm