Hardback (30 Nov 1997)
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This text covers the 1997 Electronic Packaging Conference, which discussed packaging structures for performance-driven, high-speed and high complexity electronic systems. It includes such topics as: package design issues; on-chip interconnection issues; and switching systems.
| ISBN: | 9780780341579 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| Imprint: | Institute of Electrical and Electronics Engineers |
| Pub date: | 30 Nov 1997 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 319 |
| Weight: | -1g |
| Height: | 298mm |
| Width: | 222mm |
| Spine width: | 19mm |
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