Hardback (31 Oct 1997)
Not available for sale
Includes delivery to the United States
Out of stock
This text on multi-chip modules, covers such topics as: micro/chip scale packaging; low cost MCM-L technology; design and manufacture; markets and infrastructure; flip chip and CSP; interconnect technologies; known good die; and modelling and analysis.
| ISBN: | 9780780337879 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| Imprint: | Institute of Electrical and Electronics Engineers |
| Pub date: | 31 Oct 1997 |
| Language: | English |
| Number of pages: | 379 |
| Weight: | -1g |
| Height: | 279mm |
| Width: | 216mm |
| Spine width: | 25mm |
