Print Proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Print Proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Paperback (30 Jun 2020)

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Publisher's Synopsis

Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:Autonomous, Hybrid, and Electric VehiclesEnergy Conversion and StorageFlexible and Wearable ElectronicsHeterogeneous IntegrationInternet of ThingsPhotonics and OpticsPower ElectronicsServers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions andService to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Coolingof Server Systems.

Book information

ISBN: 9780791859322
Publisher: American Society of Mechanical Engineers
Imprint: ASME
Pub date:
Language: English
Number of pages: 836
Weight: 1884g
Height: 215mm
Width: 279mm
Spine width: 48mm