More-Than-Moore Devices and Integration for Semiconductors

More-Than-Moore Devices and Integration for Semiconductors

Hardback (18 Feb 2023)

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Publisher's Synopsis

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems.

 

  • Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;
  • Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;
  • Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

Book information

ISBN: 9783031216091
Publisher: Springer International Publishing
Imprint: Springer
Pub date:
DEWEY: 621.3815
DEWEY edition: 23
Language: English
Number of pages: 200
Weight: 562g
Height: 235mm
Width: 155mm
Spine width: 18mm