Materials in Microelectronic and Optoelectronic Packaging

Materials in Microelectronic and Optoelectronic Packaging - Ceramic Transactions

Book (31 Dec 1993)

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Book information

ISBN: 9780944904633
Publisher: American Ceramic Society
Imprint: American Ceramic Society
Pub date:
DEWEY: 621.381046
DEWEY edition: 20
Language: English
Number of pages: 471
Weight: 816g
Height: 241mm
Width: 165mm
Spine width: 31mm