Materials for Information Technology

Materials for Information Technology Devices, Interconnects and Packaging - Engineering Materials and Processes

2005

Hardback (01 Sep 2005)

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Publisher's Synopsis

The fast-developing information technology industry is driving a need for new materials to facilitate the development of more reliable microelectronic products. This book is an overview of current developments and R and D activities in the field of materials used for IT with a focus on future applications. Included are materials for: silicon-based semiconductor devices (including high-k gate dielectric materials); nonvolatile memories; on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and assembly and packaging. The latest results in materials science and engineering as well as applications in the semiconductor industry are covered, including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure, and microstructure. Computer modeling and analytical techniques to characterize thin film structures are also included for a comprehensive survey of materials for the IT industry.

Book information

ISBN: 9781852339418
Publisher: Springer London
Imprint: Springer
Pub date:
Edition: 2005
DEWEY: 621.3815
DEWEY edition: 22
Language: English
Number of pages: 508
Weight: 2020g
Height: 234mm
Width: 156mm
Spine width: 28mm