Low Thermal Expansion Alloys and Composites

Low Thermal Expansion Alloys and Composites Proceedings of a Symposium Co-Sponsored by the Refractory Metals Committee of the Structural Materials Division (SMD) and the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic, and Photonics Materials Division (EMPMD), Held at the Fall Meeting of the Minerals, Metals and Materials Society in Chicago, Illinois, November 2-5, 1992

Book (31 Jul 1993)

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Publisher's Synopsis

This collection of papers is drawn from Materials Week '92 held in Chicago, Illinois, November 2-5, 1992. It presents an overview of the fabrication and application of low-thermal expansion alloys and composites. Materials engineers involved in electronics and/or aerospace applications should find significant information regarding brazing, soldering and welding.;Coverage includes - reducing inadvertent alloying of metal/ceramic brazes, characterization of solidification and weldability of Fe-29Ni-17Co alloys, co-continuous alumina-aluminum composites for heat sinks and substrates, and aluminum-filled with aluminum nitride instead of silicon carbide for improved thermal and mechanical properties.

Book information

ISBN: 9780873392068
Publisher: Minerals, Metals & Materials Society
Imprint: Minerals, Metals & Materials Society
Pub date:
DEWEY: 620.161
DEWEY edition: 20
Language: English
Number of pages: 225
Weight: 498g
Height: 229mm
Width: 154mm
Spine width: 19mm