Book (28 Feb 2001)
Not available for sale
Includes delivery to the United States
Out of stock
Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.
| ISBN: | 9780780366541 |
| Publisher: | IEEE |
| Imprint: | IEEE |
| Pub date: | 28 Feb 2001 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 478 |
| Weight: | -1g |
| Height: | 285mm |
| Width: | 203mm |
| Spine width: | 25mm |
$0.13off
Paperback
Published 21 Jun 2018
Save $0.13
$10.40off
Hardback
Published 24 Aug 2023
Save $10.40
$7.81off
Hardback
Published 29 Sep 2023
Save $7.81
