High-density Spring Interconnects for High-power Electronics Packaging
Paperback (28 Feb 2013)
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Book information
ISBN: | 9781288831654 |
Publisher: | Proquest, Umi Dissertation Publishing |
Imprint: | Proquest, Umi Dissertation Publishing |
Pub date: | 28 Feb 2013 |
Number of pages: | 54 |
Weight: | 113g |
Height: | 246mm |
Width: | 189mm |