Hardback (01 Jan 2000)
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This textbook for a one semester graduate course provides the tools to model, analyze and solve engineering applications involving conduction heat transfer. Jiji (City University of New York) balances physical descriptions with mathematical requirements. Annotation c. Book News, Inc., Portland, OR (booknews.com).
| ISBN: | 9781567001433 |
| Publisher: | Begell House |
| Imprint: | Begell House |
| Pub date: | 01 Jan 2000 |
| DEWEY: | 621.4022 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 218 |
| Weight: | -1g |
| Height: | 260mm |
| Width: | 184mm |
| Spine width: | 25mm |
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