Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties - The Electronic Packaging Series

Hardback (18 Dec 1998)

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Publisher's Synopsis

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
  • Book information

    ISBN: 9780849396250
    Publisher: CRC Press
    Imprint: CRC Press
    Pub date:
    DEWEY: 621.381046
    DEWEY edition: 21
    Language: English
    Number of pages: 114
    Weight: 354g
    Height: 235mm
    Width: 156mm
    Spine width: 12mm