Hardback (21 Mar 1994)
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Proceedings of the symposium held at the MRS 1993 Fall Meeting in Boston. The symposium dealt with materials science related to the development of electronic packaging, and the proceedings focus on five specific areas: low-cost high-performance packages; deposition and durability; packaging material
| ISBN: | 9781558992221 |
| Publisher: | Materials Research Society |
| Imprint: | Cambridge University Press |
| Pub date: | 21 Mar 1994 |
| Language: | English |
| Number of pages: | 472 |
| Weight: | 1000g |
| Height: | 236mm |
| Width: | 155mm |
| Spine width: | 28mm |
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