Design, Characterization, and Packaging for MEMS and Microelectronics II

Design, Characterization, and Packaging for MEMS and Microelectronics II - Proceedings of SPIE

Paperback (19 Nov 2001)

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Book information

ISBN: 9780819443236
Publisher: SPIE Press
Imprint: SPIE Press
Pub date:
Language: English
Number of pages: 332
Weight: -1g

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