Publisher's Synopsis
Electrical Engineering/Circuits and Devices/Physics/Chemistry Cold Plasma in Materials Fabrication from Fundamentals to Applications Cold plasma research and development activities, as well as its applications in materials processing have grown enormously in the past decade. Cold Plasma in Materials Fabrication is a comprehensive, up–to–date monograph which presents all aspects of cold, low–pressure plasmas. The eight extensive chapters in this book cover the following topics: The main parameters and classifications of different types of plasma Reactions within cold plasmas and between cold plasmas and solid surfaces State–of–the–art methods for generation and diagnostics of cold plasmas and their application for processing of materials This invaluable reference tool provides a helpful bibliography with suggestions for further reading on each subject. The book will be of importance to manufacturing engineers and scientists, as well as advanced students in engineering, materials, physics, and chemistry programs. Also of interest from IEEE Press Microelectronic System Interconnections Performance and Modeling Edited by Stuart K. Tewksbury, West Virginia University Written especially for those integrating forward–looking systems and system components, this anthology of seminal papers provides the facts needed to draw on or develop new interconnection technologies. 1994 Hardcover 528 pp IEEE Order No. PC0300–4 ISBN 0–7803–0405–5 Compound Semiconductor Transistors Physics and Technology Edited by Sandip Tiwari, IBM—T.J. Watson Research Center This handy resource offers a comprehensive look at the theoretical foundations that have been established for three of the most common forms of conventional compound semiconductor transistors: the metal–semiconductor field effect transistors (MESFETs), the heterostructure field effect transistors (HFETs), and the heterostructure bipolar transistors (HBTs). 1993 Hardcover 336 pp IEEE Order No. PC0313–7 ISBN 0–7803–0417–9 Surface Mount Technology Recent Japanese Developments Translated by TechSearch International, E. Jan Vardaman, President Available for the first time in English, these research results provide a valuable source to the most influential information on the topic of semiconductor packaging interconnect. 1993 Hardcover 336 pp IEEE Order No. PC0302–0 ISBN 0–7803–0407–1 Advances in Thermal Modeling of Electronic Components and Systems, Volume Three By Allan Kraus, Naval Post Graduate School, and Avram Bar–Cohen, University of Minnesota Co–published with ASME Press This practical book offers a cost–effective way for project man## consultants to gain a clear picture of the state of the art in the ## phenomena in electronic systems. 1993 Hardcover 416 pp IEEE Order No. PC03 ##
