Retro Gaming With Raspberry Pi
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Published 20 Feb 2024
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - Wiley - IEEE
Audio-visual / Multimedia Item (19 Apr 2019)
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Book information
| ISBN: | 9781119313991 |
| Imprint: | Wiley Blackwell |
| Pub date: | 19 Apr 2019 |
| Language: | English |
| Number of pages: | 576 |
| Weight: | 666g |
| Height: | 250mm |
| Width: | 150mm |
| Spine width: | 15mm |
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