Paperback (31 May 2024)
Includes delivery to the United States
65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.
| ISBN: | 9780791884041 |
| Publisher: | American Society of Mechanical Engineers |
| Imprint: | ASME |
| Pub date: | 31 May 2024 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 23 |
| Language: | English |
| Number of pages: | 566 |
| Weight: | 800g |
| Height: | 276mm |
| Width: | 213mm |
$5.89off
Hardback
Published 15 Jul 2016
Save $5.89
$9.06off
Hardback
Published 02 Jun 2023
Save $9.06
$9.43off
Hardback
Published 05 Oct 2023
Save $9.43
