Publisher's Synopsis
Print proceedings of the ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2015): Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini ScalesPrinted collection on 83 full-length, peer-reviewed technical papers. Topics include: Advanced Electronics and Photonics, Packaging Materials and ProcessingAdvanced Electronics and Photonics: Packaging, Interconnect and ReliabilityFundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales.
