ISTFA 2014

ISTFA 2014 Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Convention Center, Houston, Texas, USA

Paperback (30 Apr 2015)

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Publisher's Synopsis

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.

Book information

ISBN: 9781627080743
Publisher: ASM International
Imprint: ASM International
Pub date:
DEWEY: 621.381
DEWEY edition: 23
Language: English
Number of pages: xx, 540
Weight: -1g
Height: 229mm
Width: 152mm