Hardback (30 Jun 1999)
Not available for sale
Includes delivery to the United States
Out of stock
The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.
| ISBN: | 9780930815561 |
| Publisher: | IMAPS |
| Imprint: | IMAPS |
| Pub date: | 30 Jun 1999 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 362 |
| Weight: | -1g |
| Height: | 279mm |
| Width: | 216mm |
$7.78off
Paperback
Published 07 Aug 2023
Save $7.78
$2.03off
Paperback
Published 25 Sep 2023
Save $2.03
$13.30off
Hardback
Published 16 Jul 2023
Save $13.30
$8.68off
Paperback
Published 17 Oct 2023
Save $8.68
