Hardback (30 Jun 1999)
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The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.
| ISBN: | 9780930815561 |
| Publisher: | IMAPS |
| Imprint: | IMAPS |
| Pub date: | 30 Jun 1999 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 362 |
| Weight: | -1g |
| Height: | 279mm |
| Width: | 216mm |
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