Publisher's Synopsis
Covering the 'materials' aspect of the microelectronics industry, this book discusses several of the most popular materials used in packaging including ceramics and plastics, and is geared toward students and technicians.
Plastic, Thin-Film, and Ceramic Packaging
Hardback (01 Jul 1998)
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Includes delivery to the United States
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Book information
| ISBN: | 9780412154515 |
| Publisher: | Chapman & Hall |
| Imprint: | Chapman & Hall |
| Pub date: | 01 Jul 1998 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Number of pages: | 654 |
| Weight: | -1g |
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