Failure Analysis of Integrated Circuits

Failure Analysis of Integrated Circuits Tools and Techniques - The Springer International Series in Engineering and Computer Science

1999

Hardback (31 Jan 1999)

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Publisher's Synopsis

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

Book information

ISBN: 9780412145612
Publisher: Springer US
Imprint: Springer
Pub date:
Edition: 1999
DEWEY: 621.3815
DEWEY edition: 21
Language: English
Number of pages: 255
Weight: 1250g
Height: 235mm
Width: 155mm
Spine width: 17mm