Publisher's Synopsis
To compete in the marketplace, IC manufacturers must pack more and more transistors onto their chips in order to offer more features. To do so, they rely on multiple levels of IC interconnections - and this book should be useful to getting a head start in the technology. Designed for IC design, process, and manufacturing engineers, it's a step-by-step guide to manufacturing these complex devices in high volume with high yields.;The author's approach, based on his professional experience at Intel, is practical, with the focus on problem solving. He uses easy-to-grasp tools to dissect and analyze each complex process into subsystems so the reader should gain an understanding of the issues.
