Multichip Module Design, Fabrication, and Testing

Multichip Module Design, Fabrication, and Testing - Electronic Packaging and Interconnection Series

Book (30 May 1994)

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Publisher's Synopsis

The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement.;This work describes MCM technology, as well as showing designers how to use it in practice. The guide covers practical issues such as electrical testing, rework procedures and failure modes and mechanisms.

Book information

ISBN: 9780070377158
Publisher: McGraw-Hill
Imprint: McGraw-Hill
Pub date:
DEWEY: 621.381046
DEWEY edition: 20
Number of pages: 381
Weight: 704g
Height: 229mm
Width: 157mm
Spine width: 28mm