4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing Proceedings Presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000

Book (31 Aug 2000)

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Publisher's Synopsis

This work contains the proceedings of the Fourth International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing. The papers cover: novel applications; reliability; high density substrates; materials development; ICA performance; and more.

Book information

ISBN: 9780780364608
Publisher: IEEE
Imprint: IEEE
Pub date:
DEWEY: 621.381046
DEWEY edition: 21
Language: English
Number of pages: 319
Weight: -1g
Height: 279mm
Width: 203mm
Spine width: 19mm

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