2006 International Conference on Simulation of Semiconductor Processes and Devices

2006 International Conference on Simulation of Semiconductor Processes and Devices SISPAD 2006

Paperback (01 Jan 2006)

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Book information

ISBN: 9781424404049
Publisher: IEEE
Imprint: IEEE
Pub date:
DEWEY: 621.38152
DEWEY edition: 22
Language: English
Number of pages: 403
Weight: -1g