Publisher's Synopsis
This is a practical work which looks at the intricacies of including surface mount devices into an electronics assembly line. It aims to bring together information previously difficult to find and explains the different techniques of soldering to enable the electronics engineer to make smaller, lighter and cheaper circuit boards.;The work is intended for the practising engineer and although it emphasizes practical solutions to practical problems, the theoretical basis for these solutions is also provided. By building on the material within the text, solutions to new or unusual problems can be readily formulated.;The text is divided into four parts. The first provides a management overview of SMT. It describes the benefits and limitations of the technology and introduces the issues that form the basis for the remainder of the book. The second part describes the characteristics of surface mount components, with a particular emphasis on information needed for proper selection. Design considerations are discussed in part three; the emphasis is on factors that contribute to reliability and manufacturability of the finished assembly. Finally, part four describes surface mount manufacturing technologies, reviewing alternative assembly flows and exploring the factors to be considered in the selection of each process step.;Electronics design engineers, test engineers, manufacturing and assembly engineers and product engineers who design, manufacture or otherwise use surface mount devices should find this a valuable handbook.
