1996 International Conference on Simulation of Semiconductor Processes and Devices

1996 International Conference on Simulation of Semiconductor Processes and Devices Sispad '96, September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japa

Paperback (31 Dec 1996)

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Book information

ISBN: 9780780327450
Publisher: I.E.E.E.Press
Imprint: I.E.E.E.Press
Pub date:
DEWEY: 621.38152
Language: English
Number of pages: 184
Weight: -1g
Height: 298mm
Width: 215mm
Spine width: 12mm